Hollow Wafer Production Line

The hollow wafer production line is innovative food equipment which can create a variety of products of different shapes and patterns. This multifunctional biscuit machinery comes with great cost effectiveness and wide applicability.

The hollow wafer production line comes with double baking ovens. Upper and lower wafer sheets from the ovens can be coated with chocolate, cream and nuts, and then combine. After cooling in the 100m spiral cooler, the wafer book will be cut into rectangular bars by the wire cut machine and then will be transported to the packaging machine or chocolate coating machine. The whole food production line features compact structure, small floor space, and easy operation.

Technical Parameters

Production capacity: 10tons/24hours
Total power: 60Kw (380V, 50Hz)
Rate of finished products: ≥98%
Baking plate size: 470mm×325mm
Overall dimensions (L×W×H): 51.4m×5m×2.4m
Weight: 24.5t

Flat Wafers
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